Signal Integrity Journal Webinar Series

Title: Online Panel: What’s New in EM Simulations for SI/PI/EMI

Date: September 13, 2024

Time: 8am PT / 11am ET

Sponsored by: Cadence, Electro Magnetic Applications, Inc., Siemens and Ansys

Panel Participants: Eric Bogatin (University of Colorado Boulder - moderator), Gary Lytle (Cadence), Parker Hranicky (Electro Magnetic Applications, Inc.), Todd Westerhoff (Siemens), and Juliano Mologni (Ansys)

Abstract:
Interconnects are not transparent. This means that the electromagnetic properties of the cables, circuit board traces, package leads, and connector pins will only degrade system performance. The goal in product design is to keep the distortion of signals by the interconnects to an acceptable level. An electromagnetic (EM) simulator is an important tool to reduce multiple hardware iterations to save time and money. This panel pulls together industry user and developer experts to provide a perspective on how EM simulation tools are used in the product design workflow and what options are available with commercial tools. Prof Eric Bogatin moderates this panel.

Moderator: Eric Bogatin, Professor, University of Colorado Boulder
Panelist: Gary Lytle, Product Management Director, Cadence
Panelist: Parker Hranicky, Software Developer II, Electro Magnetic Applications, Inc.
Panelist: Todd Westerhoff, Product Marketing Manager, Siemens EDA
Panelist: Juliano Mologni, Lead Product Manager, Ansys


Panel Participant Bios:

Moderator – University of Colorado Boulder

Eric Bogatin, Professor

Eric Bogatin is currently a Professor in the ECEE dept at University of Colorado, Boulder, where he teaches courses on PCB design, signal integrity and systems engineering. He is also the technical editor of the Signal Integrity Journal and a Fellow at Teledyne LeCroy. Bogatin received his BS in physics from MIT and MS and PhD in physics from the University of Arizona in Tucson. He has held senior engineering and management positions at Bell Labs, Raychem, Sun Microsystems, Ansoft and Interconnect Devices. He has written 15 technical books in the field and presented classes and lectures on signal integrity worldwide.

Cadence

Gary Lytle, Product Management Director

Gary Lytle is product management director of multiphysics simulation and analysis at Cadence, leading product strategy, positioning, sales enablement, and demand generation for Cadence electromagnetic simulation technologies. Gary has held may positions in the RF and simulation industry, including technical director with ANSYS, Inc, lead antenna design engineer with Dielectric Communications, combat systems engineer with General Dynamics, and engineering manager with Amphenol. He holds a BSEE from the University of Southern Maine and an MBA from Saint Joseph's University. He holds four U.S. patents and currently serves in the U.S. Coast Guard, after previously serving in the U.S. Navy for a combined service of 23 years.

Electro Magnetic Applications, Inc.

Parker Hranicky, Software Developer II

CColorado School of Mines, B.S. Mechanical Engineering, 2020.

Colorado School of Mines, Candidate for M.S. in Computer Science, 2025.

Parker Hranicky is a Software Developer II at Electro Magnetic Applications where he leads the new EMA3D Connect group that focuses on Visualization, Collaboration, and AI/ML. Mr. Hranicky is also working on his M.S. Thesis, which focuses on enhancing numerical simulations using machine learning. He aims to apply data-driven and physics-informed methods to reduce the complexity of modeling physical phenomena while maintaining high accuracy. He joined EMA in 2023 and has been contributing to development operations, software testing, and API development.

Siemens

Todd Westerhoff, Product Marketing Manager

Todd is the Product Marketing Manager for High-Speed System Design in the Electronic Board Systems division of Siemens EDA. Todd has over 45 years of experience in electronic system modeling and simulation, including 28 years of signal integrity experience. Todd was heavily involved with the IBIS-AMI modeling specification during its inception. Prior to joining Siemens EDA, he held senior technical and management positions at SiSoft, Cisco and Cadence. He also worked as an independent signal integrity consultant developing analysis methodologies for major systems and IC manufacturers. Todd holds a B.E.E.E. degree from the Stevens Institute of Technology in Hoboken, NJ.

Ansys

Juliano Mologni, Lead Product Manager

Juliano Mologni joined Ansys in 2019 as a product manager for electronics products. With more than 25 years of experience in computational electromagnetics, he is the author of patents and more than 60 journal and conference papers. His previous experience includes Lead Application Engineer at ESSS, Systems Engineer at Delphi Automotive and Hardware Engineer at WebTech Wireless.

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