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In its new power electronics report, "Status of the Power Module Packaging Industry," the Yole Group explores how the power module packaging supply chain is continually being reshaped.
In the latest market and technology report, “Overview of the Semiconductor Devices Industry H1 2025,” Yole Group analyzes each semiconductor segment and highlights significant growth rates exceeding 10% for servers and automotive applications.
Yole Group released its new "Semiconductor Trends in Automotive" report, 2024 edition, providing an in-depth understanding of the changing automotive industry ecosystem and supply chain.
The power electronics supply chain has undergone a phase of rapid expansion in manufacturing capacity, particularly for SiC and silicon devices, as well as SiC wafers.
The "Computing and AI for Automotive" report from Yole Group provides an overview of computing for safety, ADAS and AD, in-cabin sensing, cockpit and connectivity applications.