Items Tagged with 'Impedance'

In this article, Donald Telian supplies a reference point for making the task of implementing via impedances, thus removing via impedance discontinuities, less daunting. Read on to find out how he can help.

In Donald Telian’s book he reveals his steps for successful serial links, called the “7 Steps to Successful Serial Links.” In this article, he discusses his most important steps: (one) minimize discontinuities, and (two) manage loss.  

Who doesn’t love an easy-to-use 2D field solver to calculate the single-ended or differential impedance of PCB transmission lines? Eric Bogatin takes this one from Sierra Circuits for a test drive.

With the recent introduction of the Averatek Semi-Additive Process (A-SAP) process, linewidths under 1 mil are possible using the same fabrication processing line as for traditional 4 mil wide lines. This opens up the possibility of using narrower traces in the BGA escape region than in long-path routing regions. However, using this routing architecture means the narrower traces in the BGA escape field are at a higher impedance than the wider, 50 ohm traces in the routing region. So, how long can these traces be before the impedance mismatch is a problem? The authors of this piece propose an analysis methodology to find out.