Items Tagged with 'PCB signal traces'

Successfully designing a PCB with more than one impedance while maintaining a manufacturable and economical product can be a difficult challenge. By examining the histories and uses of various impedances, Lee Ritchey simplifies the process and discusses the ideal impedance for PCB stackup design.

In this article, Douglas Brooks and Johannes Adam illustrate how the thermal impacts of heated traces and pads are not limited to the board layer on which they exist; read on to see how they are reflected on every board layer above and below them.