Items Tagged with 'event'

EDICON China 2024 made a grand return and was successfully held at the China National Convention Center in Beijing on April 9-10.  

Donald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving SI challenges in today's fast-paced technological landscape.

Indium Corporation’s leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, where topics will include sustainability, assembly processes, and EV electronics.

The informative virtual Rohde & Schwarz event will span two half days, offering design engineers the opportunity to attend application-oriented presentations delivered by oscilloscope experts.

Rohde & Schwarz has announced the U.K. dates and venues for the in-person Demystifying EMC Global Tour for April 25 in Reading and April 27 in Leeds. 

March 14-16 event in Nuremberg, Germany, to include nine MIPI presentations.

DesignCon, the premier high-speed communications and system design conference returns to its home at the Santa Clara Convention Center in Santa Clara, Calif., with technical paper sessions, tutorials, industry panels, product demos, and exhibits April 5-7, 2022.

Last night, at EDI CON China 2018, the conference and exhibition that brings together engineers working on high-frequency analog and high-speed digital designs, the winners were announced in the EDI CON Innovation Awards. This award program honors products that have had the greatest impact on the industry this year, providing the tools necessary to bring on the next generation of electronic design innovations.