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The new TESD devices’ unique design features proprietary bidirectional clamping cells for ESD protection up to ±30kV in an ultra-small DFN0603 package.
Taiwan Semiconductor has announced its new ThinDPAK family of ultra-fast-recovery Schottky rectifiers, which have the same footprint as standard DPAKs, but come in a thinner package and offer superior power density and thermal performance.