Items Tagged with 'OFC 2025'

1.6T, 800G, and 400G validation solutions take to the show floor as AI continues to drive data demand.

Designed for AI workloads and hyperscale data center environments, the new 1.6T and 800G PICs enable breakthrough levels of performance, density, and power efficiency.

Live demonstrations of the latest optical testing technology to be conducted in Anritsu and strategic partners’ booths throughout OFC 2025.

Samtec high-density copper and optical interconnect products are being demonstrated in Booth #5863 at OFC 2025.

Molex unveils its VersaBeam Expanded Beam Optical Interconnect Solutions, an innovative family of high-density fiber connectors optimized for hyperscale data center, cloud, and edge computing environments.