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Last night, at EDI CON China 2018, the conference and exhibition that brings together engineers working on high-frequency analog and high-speed digital designs, the winners were announced in the EDI CON Innovation Awards. This award program honors products that have had the greatest impact on the industry this year, providing the tools necessary to bring on the next generation of electronic design innovations.
EDI CON China 2016 set new records for attendance and sponsorship, with more than 3,100 unique attendees — including 1,855 delegates. Attendance grew by 35 percent, and the exhibition grew by 32 percent, making it the largest RF/microwave, EMC/EMI and high-speed digital design event in China.
EDI CON China 2016 set new records for attendance and sponsorship, with more than 3,100 unique attendees — including 1,855 delegates. Attendance grew by 35 percent, and the exhibition grew by 32 percent, making it the largest RF/microwave, EMC/EMI and high-speed digital design event in China.