Items Tagged with 'EDA'

ARTICLES

PCB Laminate Anisotropy The Impact on Advanced Via Modeling 1-25-24.png

PCB Laminate Anisotropy: The Impact on Advanced Via Modeling

Since woven glass PCB substrates are anisotropic, EDA design and modeling software hoping to advance AI and ML algorithms should have provisions to model anisotropic material, especially via transitions. In this article, Bert Simonovich discusses the importance of having an awareness of the test method used by CCL suppliers for accurate modeling and simulation. Simonovich covers how the use of out-of-plane Dkz values instead of in-plane Dkxy values for via modeling can cause misleading simulation results, which may result in reduced margins and potential compliance test failures when the design is built and tested. 


Read More
THUMB

A Brave New World: Simulating DDR5

Eagerly anticipated, the next generation of DRAM technologies (DDR5/LPDDR5) are presently being validated in the lab by leading silicon vendors worldwide. This latest generation has a big surprise in store for hardware engineers and SI specialists that need to simulate such systems. DDR5 will introduce decision feedback equalization (DFE) for the DRAM receiver for the very first time.


Read More