Items Tagged with 'Samtec'

SLH/TLH PCB board-to-board connectors are part of Samtec’s Ultra Micro line of products that maximize overall space and offer reliable connections in high data rate rugged environments such as automotive, industrial IOT, robotics, and military and aerospace.

Samtec will demonstrate next-generation, high-performance optical and copper interconnect solutions at the upcoming ECOC exhibition.

Samtec has announced new additions to its A-Series family of parts which include a Level 3 Product Part Approval Process package suited for use in automobile applications.

Samtec has announced availability of its NovaRay cable assemblies that combine extreme density and performance by using 40% less space than traditional arrays to support 112 Gbps PAM4 per channel.

Available freely to Samtec customers under NDA, SIBORG works with Ansys HFSS 3D Layout to generate, visualize, optimize, and develop PCB package and component break out regions.

Samtec, Inc. will be demonstrating next-gen, high-performance optical and copper interconnect solutions at the upcoming OFC 2024 Exhibition, the premier global event for optical communications and networking.

Samtec has expanded its successful line of Edge Rate board-to-board connectors to include a higher density mated set that is half the width of previous designs and offers a lower-profile 5 mm mated height.

As a Diamond Sponsor of the event, Samtec will showcase products that support a new era of high-speed connectivity, and Samtec engineers will participate in 11 papers, panels, or presentations.

Samtec, Inc. is shipping the Optical FireFly Micro Flyover System, the first interconnect system with the flexibility to use micro-footprint high-performance optical and copper interconnects interchangeably.

Samtec, Inc.’s Generate high-speed edge card sockets (HSEC6-DV Series) support 64 Gbps PAM4 (32 Gbps NRZ) applications and are PCIe 6.0 capable.