Items Tagged with 'aerospace'

MLPS Flatpack series allows designers to create higher-performance end products optimized for 105°C.

Mercury Systems, Inc. has introduced the Common Module System X08, the industry’s first rugged, open standards-based blade server architecture to deliver a plug-n-play infrastructure model for tactical platforms operating at sea, on land, or in the air

Ramping up production at its Colorado Springs fabrication campus will enable Microchip to respond to growing semiconductor demand across a wide swath of industries.

CAES and Lattice Semiconductor Corporation announced an agreement whereby CAES will qualify and sell radiation-tolerant Lattice FPGAs for space and satellite applications.

Component manufacturers continue to develop increasingly miniaturized bulkhead filter capacitors that also offer increased current capacity, voltage, and operating temperature ranges. This post looks at the details of this miniaturization in order to help aerospace systems designers satisfy stringent size and weight constraints and further improve system performance.