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SCALINX, a fabless semiconductor company based in France and specializing in advanced mixed-signal chip design, has successfully concluded its second funding round, securing a global investment of €34 million.
Featuring low 0.88 mm profile and wettable flanks, Automotive Grade 200 V, 400 V, and 600 V devices provide improved thermal performance and efficiency.
If you are working on chip and package design, ground bounce is an important concern. SIJ Technical Editor Eric Bogatin and his University of Colorado students share the results of a study in best design practices to minimize ground bounce noise.
