Items Tagged with 'components'

HARTING engineers have taken up the challenge of developing a component that will increase automation, save work steps, and reduce costs for customers, resulting in the 3D-MID Component Carrier.

Passive Plus, Inc.  is now offering the 1313C (1.30” x 1.30”) series capacitor. The main features of the series are: High-Q above 10,000, low ESR, high operating voltage, high operating current, and high reliability.

MACOM Technology Solutions Inc. announced a complete PAM-4 technology chipset for 100G data rates over a single wavelength enabling single fiber and four-lane parallel fiber connectivity for 100G, 200G and 400G Ethernet applications. This chipset features a new transimpedance amplifier (TIA), transmit and receive clock and data recovery (CDR) devices and linear Electro-Absorption Modulated Laser (EML) driver module.

Passive Plus, Inc. (PPI) now offers extended-values for the Traditional NP0, Hi-Q 0505 (.055” x .055”) -- now available up to 1,000pF and an increased operational temp up to 200°C. These parts exhibit Low ESR/ESL, Low Noise, High Self-Resonance as well as ultra-stable performance over temperature. Usually used for wireless broadcasting equipment, mobile base stations, GPS, MRI, and radar applications and offered in magnetic and non-magnetic terminations.