Items Tagged with 'Thermal Risk Management'

As of 2024, single-phase direct-to-chip (D2C) cooling dominates the high-end GPU thermal management market. However, with the increasing thermal design power, two-phase D2C cooling will be required, and it is expected to come in large volume no earlier than 2026 and 2027.

YINCAE, a leading manufacturer of high-performance electronic materials, has announced the release of its breakthrough product Thermal Underfill - UF 158A2.

Current density can be an interesting concept. Graphics based on current density can be fascinating. But from a practical standpoint, current density is irrelevant. It is a consequence of other things, not a determinant of them. What follows will explain why.

The ability to analyze and predict the current/temperature effects of isolated traces is helpful, but the actual temperature of a trace may be different because of uncertainties in the actual trace thickness or board material thermal conductivity coefficient. This article traces the effort to see what PCB board parameters have the most impact in determining trace temperatures, followed by a look at related PCB design considerations. Read on to learn more.