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Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide-free, and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
Indium Corporation’s Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.
Indium Corporation’s leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, where topics will include sustainability, assembly processes, and EV electronics.
Indium Corporation will feature its innovative Durafuse solder technology alongside its Rel-ion portfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing at IPC APEX EXPO 2024.
Indium Corporation will introduce a novel alloy technology that enables lower processing temperatures in preform soldering, at Productronica 2023, November 14-17, in Munich, Germany.
Solder Chemistry will feature its proven solder paste solutions as part of the prestigious Fraunhofer Future Packaging production line exhibition at SMTconnect in Nuremberg, Germany.
Indium Corporation has released a new, bismuth-based low-temperature alloy developed for low-temperature reflow processes which require enhanced thermal cycling reliability.