Next-generation wireless communication and radar systems demand increased RF power within a smaller footprint to meet performance and size requirements. This paper discusses the impact of operating temperature on RF device performance and reliability and presents a thermal analysis solution based on FEA that is integrated within a dedicated RF component design platform.

An efficient computational design optimization method, combining full-wave electromagnetic simulation in COMSOL Multiphysics® software with a space-mapping (SM) algorithm implemented in MATLAB® software.