Teledyne LeCroy announced support for PCI Express® 6.0 electrical test and validation with QPHY-PCIE6-TX-RX fully automated test software, as well as SDAIII-PCIE6 and SDAIII-PAMx characterization and debug software packages.

The growth of new technologies, including artificial intelligence (AI), machine learning (ML), and high-performance computing (HPC), are accelerating demand for fast access to large amounts of data. To support this growing demand, the next generation of PCI Express, PCIe 6.0 technology, will use multi-level signaling (PAM4) to double data transfer speeds from the 32 GT/s transfer speed provided by PCIe 5.0 technology. While this helps satisfy the need for fast data access, the new multi-level signaling approach will create significant new test complexities for system developers.

Teledyne LeCroy’s new QPHY-PCIE6-TX-RX fully automated test software, and the SDAIII-PCIE6 and SDAIII-PAMx characterization and debug software packages, when used together with a Teledyne LeCroy LabMaster 10 Zi-A oscilloscope and SDAIII-CompleteLinQ serial data analysis software, provide PCIe developers with the tools they need to test and debug complex PCIe 6.0 devices. This new solution can:

  • Calculate and display jitter in three unique transition groupings
  • Measure transmitter equalization (Tx EQ) settings, with results and methodologies aligned with current SigTest AC fit methods
  • Provide customizable setups for measuring preset cursors and waveforms using unique transmitter equalization tools
  • Measure Signal-to-Noise-and-Distortion Ratio (SNDR) with robust oscilloscope noise compensation and powerful signal analysis waveform views.