Items Tagged with 'PCLe'

Spectrum Instrumentation’s complete line of PCIe digitizer cards can now perform digital down-conversion thanks to a low-cost option that uses an external GPU card for continuous “on-the-fly” processing.

Teledyne LeCroy announced availability of new PCI Express 6.0 EDSFF interposers based on new Teledyne LeCroy TAP6 technology that reduces signal integrity issues for enhanced probing in high-speed projects.

The addition of two new PCIe Digitizer cards from Spectrum Instrumentation extends the company’s flagship M5i series to deliver optimal GHz signal acquisition and analysis capabilities.

Keysight will participate at embedded world 2023 to showcase how design, emulation, and test expertise can create the best embedded design experiences with intelligent insights to empower IoT networks, autonomous driving, and batteries.

New software tools support faster 64 GT/s data transfer speeds using PAM4 multi-level signaling.

Anritsu Company demonstrates solutions, technologies, and methodologies to verify high-speed communications designs during DesignCon 2023.

It’s all about the data. Loads and loads of data. How do you build a system to handle it? This article looks at interconnect options for the new PCI Express 6.0 specification: which interconnect system to choose, how to maintain signal integrity, and how to address design challenges.

Many claim that for stripline, it is ok to cross a split power plane, so long as the other adjacent reference plane is solid. Some others claim if there is an adjacent solid reference plane, less than 5mils away under the split, crosstalk will be mitigated. Read on to see an investigation into what really happens when stripline signals cross split power planes.