Indium Corporation is proud to introduce a novel alloy technology that enables lower processing temperatures in preform soldering, at Productronica 2023, November 14-17, in Munich, Germany. Specifically developed for power module package-attach applications, Indalloy®301-LT is a bismuth-free alloy that prevents thermal defects in the module without sacrificing reliability like traditional bismuth-containing, low-temperature alloys.

Available in InFORMS® configurations, Indalloy301-LT offers a solution for consistent bondline thickness and improved strength to enhance thermal and mechanical reliability of the solder joint while reducing processing temperature and energy input during manufacturing. This enables complementary Pb-free high-reliability alloy technologies such as Indalloy®276 to be used in power module die-attach, component-attach, or interconnects without the risk of re-melt and degraded performance. Indalloy®301-LT is also available in preforms and ribbon configurations and can be offered flux-free or with Indium Corporation’s flux coating technology.

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“With increasing mission profile demands in power electronics applications, such as EV power module-cooler integration, preform soldering offers superior thermal and mechanical performance compared to traditional thermal interface materials,” said product manager Joe Hertline. “By leveraging this new alloy technology in package-attach applications, designers can prevent warpage, encapsulation breakdown and delamination issues by reducing processing temperature, making preform soldering a viable approach with robust thermal and mechanical reliability performance.”

Indalloy301-LT features:

  • Reduced reflow peak temperatures by 50°C compared to commonly used alloys in power electronics assembly
  • Prevention of warpage and delamination in molded power module package-attach
  • Ability to step-solder with Pb-free alloys
  • Excellent thermal and electrical conductivity
  • Solid reliability performance (TST -40°C–125°C)
  • Reduced energy consumption
  • Available in preforms, ribbon, and InFORMS®