The 9th Electronic Design Innovation Conference, EDICON China 2024, was successfully held at the China National Convention Center in Beijing on April 9-10. EDICON China is an annual event in the field of microwave/RF/wireless, organized by Horizon House (USA) and ACT International (Hong Kong), with Microwave Journal, Microwave Journal China, and Signal Integrity Journal as the official media.

The two full-day event included technical sessions and live demonstrations by leading companies, including plenary keynote speeches, technical presentations, and sponsor workshops. The conference featured over 60 presentations and over 60 exhibitors showcasing the latest and practical products/solutions/services. 1500+ industry professionals attended the conference. The exhibition halls were packed and the conference rooms were filled to capacity. The most popular chip and semiconductor sessions were filled to capacity, with many occupying standing room only.

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Highlights:

  • The keynote speeches delivered by Dr. Liu Guangyi, Chief Expert/6G Director of China Mobile, Dr. Benoit Derat, Senior Director of Engineering of Rohde & Schwarz, and Dr. Le Xiang, R&D Director of Wireless Solutions Business Unit of Keysight, discussed 5.5G/6G technology together from multi-dimensional perspectives.
  • Invited scholars from Chinese Academy of Sciences, Tsinghua University, Beijing Institute of Technology, and industry leaders gave five expert presentations.
  • Keysight and Qorvo shared their insights and technology advancements in the Wi-Fi 7 track.
  • Test and measurement technology was the core topic of the conference, with more than 20 presentations and 25 exhibitors bringing the latest relevant technologies and solutions.
  • Presentations related to chip technology, mmWave technology, antenna technology, and radar technology demonstrated the depth of expertise.

The presentations at this conference covered rich and diverse topics, including 6G, Wi-Fi 7, mmWave, terahertz, test and measurement technology, instruments and accessories, design/modeling/simulation, chip, satellite communications, radar, positioning, navigation, phased array, GaAs, GaN, RF-SoC, communication-sensing fusion, massive MIMO, antenna, RIS, beamforming, software defined radio, NTN, IoT, network security, power amplifier, PCB, components, EMI/EMC, SI/PI, and many other fields.