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Molex continues to build on its automotive industry expertise with the introduction of its MX-DaSH family of data-signal hybrid connectors that unify power, signal, and high-speed data connectivity in a single connector system.
IDTechEx’s report, “Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets”, explores how flexible and printed electronics can be integrated into cars and homes to create modern aesthetics that are beneficial and easy to use.
This article identifies the primary culprit behind the elevated radiation emission levels during CISPR-25 compliance assessments and presents practical solutions for regulatory adherence that impact automotive design and testing while supporting the evolution of more refined EMC standards. Read on to learn how this approach enhances vehicle safety and performance by addressing electromagnetic interference.
Indium Corporation’s Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.
Infineon Technologies AG introduces the 750V G1 discrete CoolSiC MOSFET to meet the increasing demand for higher efficiency and power density in industrial and automotive power applications.
