Signal Integrity

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PCB connector suppliers are often tasked with providing connectors that meet today’s high-speed and high-density requirements. In many cases, these connectors also need to maintain signal integrity under harsh conditions. Such models make it possible to simulate how the connector will interface and perform in its surrounding environment. IEH has partnered with Modelithics to offer 3D geometry models for various IEH hyperboloid connector products.

Successfully designing a PCB with more than one impedance while maintaining a manufacturable and economical product can be a difficult challenge. By examining the histories and uses of various impedances, Lee Ritchey simplifies the process and discusses the ideal impedance for PCB stackup design.

In a tribute to Bob Pease, David Banas explores the concept of unbounded jitter and how it aligns with the concerns of engineers and link designers. In his discussion of the definition, constituents, and practical limits of jitter, Banas embodies the simplistic approach of his hero. 

High-speed digital links at 224 Gbps per lane, device miniaturization, and ultra-low power budgets result in sophisticated systems that are more complex to optimize signal integrity performance and reliability. Engineers require close collaboration and seamless flows from concept to simulation, emulation, and testing to keep up with technology's pace and meet shrinking time-to-market expectations.

This eBook covers how to connect design workflows to make end-to-end high-speed digital design a reality. It will discuss the challenges and trade-offs associated with optimizing design performance for technologies such as PCIe 6.0, USB4 Version 2.0, and USB-C, DDR5, and LPDDR.

At DSEI Japan, Teledyne SP Devices demonstrated the industry’s first implementation of peer-to-peer streaming between commercial-off-the-shelf digitizers and GPUs in PXIe Systems.

In this article, Bert Simonovich explores how to avoid “garbage in, garbage out” with field solvers by building an understanding of the nuances of PCB fabrication processes, the interpretation manufacturers’ data sheets, and the tool’s user interface.

Eric Bogatin takes a closer look at the potential consequences of the widening gap between industry demand and the supply of engineers with signal integrity design skills, and poses potential solutions to inspire future generations of signal integrity engineers.

Solutions will test edge-to-core O-RAN subcomponents to verify interoperability and measure performance during competition.

IDTechEx evaluates the benefits and challenges of embedding electronic functionality.