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DesignCon, North America’s largest chip, board, and systems event, announced the annual conference and exhibition – historically slated for the January time frame at the Santa Clara Convention Center – will now be held April 13-15, 2021 at the larger Global Biorisk Advisory Council (GBAC) STAR accredited San Jose McEnery Convention Center.

Rohde & Schwarz announces the launch of the R&S FSW-B8001 option. It extends the internal analysis bandwidth of the R&S FSW high-end signal and spectrum analyzer to 8.3 GHz. Covering an input frequency range of up to 90 GHz, the instrument provides an unmatched dynamic range and sensitivity, precision, and EVM performance.

Kyocera Corporation announced its 5811 series board-to-board connectors, miniaturized to be about 50 percent smaller than conventional products and optimized for wearable devices.

Members of the TELUS and Ciena teams push the limits of what can be achieved in optical networking and realize milestones for the industry along the way. 

The ongoing Covid-19 pandemic has shown how important it is for companies to operate remotely. In fact, it’s the difference between completing a task or facing extensive delays for businesses relying on certified equipment for day-to-day activities, Chris O’Conor, Regional VP, Service Provider Sales at HUBER+SUHNER Polatis said.

Trackwise, continues to strengthen its production capability and capacity by investing in equipment. The company has installed a highly advanced roll-to-roll direct imaging system and has also invested in a roll-to-roll flexible circuit laser drilling system.

Sumitomo Electric Industries, Ltd. has succeeded in mass production of FLUOROCUIT ™, fluororesin-based flexible printed circuits (FPCs) that demonstrate a high flexibility and low transmission loss in the millimeter-wave band, aiming at communications for 5G and beyond.

The SPE System Alliance hosts an international, digital exchange of knowledge between experts of different industries and technology sectors on the topic of Single Pair Ethernet.

Sintecs, is proud to announce it has entered into a value-added reseller agreement with Mentor.  Under the agreement, Sintecs will sell and provide technical design services and support for Mentor’s HyperLynx high-speed printed circuit board design and verification software in Europe. 

TE Connectivity (TE), extends its small form-factor pluggable (SFP) product portfolio with small form-factor pluggable double density (SFP-DD) products for input/output (I/O) interconnects.