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Introspect Technology announced that it has shipped the M5512 GDDR7 Memory Test System, the world’s first commercial solution for testing JEDEC’s newly minted JESD239 GDDR7 SGRAM specification.

Donald Telian and The EEcosystem announce the global tour of "Signal Integrity, In Practice," a groundbreaking LIVE masterclass designed to equip hardware engineers with essential skills for solving SI challenges in today's fast-paced technological landscape.

At the heart of Bridge12's next-generation EPR spectrometer is a pair of Spectrum Instrumentation cards. 

Available freely to Samtec customers under NDA, SIBORG works with Ansys HFSS 3D Layout to generate, visualize, optimize, and develop PCB package and component break out regions.

IDTechEx explores the opportunities and challenges for QRNG in the growing connected devices and quantum communications markets.

Indium Corporation’s Senior Research Metallurgist, Jie Geng, Ph.D., will conduct a webinar on low-voiding, high-reliability, lead-free solder paste for automotive applications.

VIAVI has announced the addition of performance testing capability for PQC system deployments.

Pendulum Instruments has announced the new CNT-102 dual-channel frequency analyzer.

Infineon Technologies AG announced the XENSIV™ Sensor Shield for Arduino, a versatile tool designed for evaluating smart sensor systems in smart home and diverse consumer applications.

Viavi Solutions Inc. shared milestones in 6G and AI research based on the company’s 6G Forward Program.