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Corning Incorporated has announced the launch of its Multifiber Pushlok Technology, the latest advancement in its award-winning Evolv portfolio of connectivity solutions.
Samtec, Inc. will be demonstrating next-gen, high-performance optical and copper interconnect solutions at the upcoming OFC 2024 Exhibition, the premier global event for optical communications and networking.
Spectrum Instrumentation has released a new firmware option for its range of versatile 16-bit AWGs with sampling rates up to 1.25 GSPS and bandwidths up to 400 MHz.
Keysight Technologies, Inc. and Credo Semiconductor set a new milestone by developing a joint testbed that demonstrates the first IEEE P802.3dj draft specification compliant 1.6 terabit Ethernet measurement system running full line rate layer 2 Ethernet traffic on a real world hardware development platform.
ZTE Corporation announces its collaboration with China Mobile in activating the world's first ultra-long-haul optical backbone link based on 400G Quadrature Phase Shift Keying (QPSK) technology.
Richardson Electronics, Ltd. announced a global distribution agreement with Ideal Power for products including the discrete B-TRAN device and SymCool power module.
Signal Edge Solutions announced a strategic partnership with Select Fabricators where Signal Edge Solutions distribute Select Fabricators' range of EMI shielding tents, pouches, curtains and signal isolation enclosures.
Indium Corporation’s leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, where topics will include sustainability, assembly processes, and EV electronics.
Foxconn Interconnect Technology showcased the demonstration of its 224 Gbps signal transmission through their OSFP 2x1 SMT connector Upper Port with a 1M Passive DAC at the DesignCon 2024 exhibition.
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