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The key benefits of gallium nitride (GaN) are, amongst others, high power density, best-in-class efficiency and decreased system costs. Infineon Technologies AG is starting volume production for CoolGaN™ products by the end of 2018, the company announced during PCIM Europe.

At this week’s 2018 IEEE International Interconnect Technology Conference (IITC 2018), imec, will present 11 papers on advanced interconnects, ranging from extending Cu and Co damascene metallization, all the way to evaluating new alternatives such as Ru and graphene.

With the MAX22505 ±40V high-speed USB fault protector from Maxim Integrated Products, Inc., designers can now eliminate USB port damage from all faults, including ground potential differences, up to ±40V without the tradeoffs required by competing solutions. It protects data and power lines from industrial equipment powered at 24V_AC and 40V_DC, while also reducing solution size by more than 50% for industrial voltage applications.

Artech House today announced the publication of Intersystem EMC Analysis, Interference, and Solutions by recognized expert Uri Vered. This comprehensive new resource provides methods and tools for defining EMC requirements and techniques for performing predictions and calculations to achieve electromagnetic compatibility.

Imec, today announced that it has demonstrated for the first time a low-cost impingement-based solution for cooling chips at package level.  This achievement is an important innovation to tackle the ever-increasing cooling demands of high-performance 3D chips and systems.

Microsemi Corporation, today announced its extremely low inductance package dedicated to high current, low specific on-resistance (RDSon) Silicon Carbide (SiC) MOSFET power modules.

Automotive designers can significantly lower EMI and increase efficiency with the pin-compatible MAX20073 and MAX20074 buck converters from Maxim Integrated Products, Inc. The compact converters, which offer one of the lowest EMI performance for low-voltage point-of-load applications, which are ideal for automotive infotainment and ADAS applications.

Keysight Technologies, Inc., today announced that Ixia, a Keysight Business, is first to ship a 400GE test system with multi-rate 200/100/50GE speed options for the K400 400GE QSFP-DD load module family. These multi-rate speed options allow network equipment manufacturers (NEMs) to test products at speeds based on the new IEEE 802.3cd draft standard and IEEE 802.3bs standard using the 400GE QSFP-DD module at 200GE, 100GE, and 50GE speeds, from a single port.

Richardson RFPD today announced the availability and full design support for a new portfolio of board level shields from TE Connectivity. These new board level shields are stamped one- and two-piece metal cages that help provide isolation of board-level components, minimize crosstalk and reduce EMI susceptibility without impacting system speed.