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Rogers Corporation is pleased to introduce RO4460G2, low loss bondply with a 6.15 dielectric constant (Dk). RO4000® thermoset high performance bonding layers have long been used by circuit designers for multilayer board constructions using Rogers high frequency and high speed digital materials where operating frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials.

Richardson RFPD, Inc. announced today the availability and full design support capabilities for two new series of DC/DC converters from RECOM Power, Inc. (RECOM). 

Saelig Company, Inc. has introduced the Euroquartz QuikXO HC_JF series of switchable crystal oscillators that can provide four different preselected frequencies.

Intel today announced it has begun shipping its Intel® Stratix® 10 TX FPGAs, the only field programmable gate array (FPGA) with 58G PAM4 transceiver technology. By integrating the FPGA with 58G PAM4 technology, Intel Stratix 10 TX FPGAs can double the transceiver bandwidth performance.

UK – Zuken® and XJTAG®, have released a plugin that will enhance Zuken’s CR-8000 with a design for test (DFT) capability improving test coverage by allowing additional design checks during schematic entry. 
 

Mitsubishi Electric US, Inc., Semiconductor and Device Division will exhibit for the first time at Applied Power Electronics Conference (APEC) in San Antonio, March 5-7, 2018.  The Semiconductor and Device Group will display its full lineup of power semiconductor products (formerly the Mitsubishi Products and Accessories Division of Powerex, Inc.) in booth #919.

Manufacturers of electronic equipment for Hi-Rel applications often struggle to meet stringent EMC and safety standards.  Knowles Precision Devices (KPD) has a range of EMI components, under the SYFER brand, that particularly appeal to designers in the medical implantable and space sectors as well as industrial, automotive, aerospace and telecom applications.