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TE Connectivity (TE), has extended its modular twisted pair cable assembly offering with new M12 cable assemblies. Conforming to EN45545 HL3 with fire and smoke characteristics, TE’s M12 cable assemblies are suitable for public transportation and other heavy industrial applications. Their rugged design enables them to withstand the vibrations experienced in trains and other demanding environments.

Keysight has announced the new Infiniium UXR series, the only oscilloscopes to support terabit research with real-time bandwidth up to 110 GHz industry-leading sample rate (256 GSa/s) and signal integrity (lowest noise and jitter).

TE Connectivity (TE) is pleased to announce it has partnered with Annapolis Micro Systems, a leading FPGA board and systems supplier, on the release of three of their new high-performance FPGA boards that feature TE’s NanoRF module.

Passive Plus Inc. has the 01005BB104 broadband 100nF multilayer ceramic capacitors. The 01005BB104 – the smallest 100nF broadband part characterized for RF performance -- has a case measuring (mils) 16 x 8 x 8, and offers resonant-free RF coupling/DC blocking from 16 kHz (lower 3-dB frequency) to beyond 65 GHz with < 1 dB insertion loss and < -15 dB return loss on suitable substrates.

Nanosecond-level clock synchronization can be an enabler of a new spectrum of timing- and delay-critical applications in data centers. However, the popular clock synchronization algorithm, NTP, can only achieve millisecond-level accuracy. Current solutions for achieving a synchronization accuracy of 10s-100s of nanoseconds require specially designed hardware throughout the network for combatting random network delays and component noise or to exploit clock synchronization inherent in Ethernet standards for the PHY.

IQD has launched a new range of LVPECL (IQXO-623/IQXO-624) & LVDS (IQXO-618) output clock oscillators with the phase jitter of less than 1ps rms (over 12kHz to 20MHz) irrespective of which output is specified.

TE Connectivity (TE), today introduced its new extra-large array (XLA) socket technology, which provides more reliable performance with 78 percent better warpage control than traditional molded socket technologies. The XLA socket technology allows TE to design enhanced sockets to support high data speeds in next-generation data centers.