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The conventional PCB fabrication process for printed circuit boards is subtractive. Averatek recently introduced a new chemistry technology making semi additive circuit board fabrication more attractive for ultra fine line applications. SIJ’s technical editor, Eric Bogatin, takes a closer look.
Understanding a few simple power integrity (PI) fundamentals can go a long way towards increasing design margins when delivering power to high-speed digital loads. In this piece, Heidi Barnes provides some fundamental lessons on impedance.
In lieu of the given applications and industry efforts, many enterprises and industries are now viewing silicon photonics as an inevitable component for computers and monitoring devices. As the technology is touted to mature in the coming years, chances are that supercomputers would likely reach the exascale speed around human brain’s processing power at the neural level.
Stefaan Sercu, Samtec Signal Integrity R&D Engineer, recently presented “Impedance Corrected De-Embedding,” which discussed the advantages of impedance corrected de-embedding over standard 2X through de-embedding, here are some highlights of his talk.
There is an unsatisfied thirst by professional engineers to play with tools that give them a taste of the pro-level tools. Eric Bogatin makes his argument for low cost or “student level” equipment from tool vendors.
Recently, Ansys released its HFSS Mesh Fusion product for simulation of complex EM systems. Signal Integrity Journal (SIJ) followed up with Dr. Matthew Commens, Principal Product Manager, HF at Ansys, Inc., to find out some more details.
One of the main challenges of performing analysis upstream is incomplete models used in analysis. Normally the full physical layouts from which extractions are performed on interconnect do not yet exist. So how does one fill in the blanks to perform early analysis?
We want to follow this mantra of 85 ohms for PCIe, but it may not be so easy. Here’s a look at exactly what the spec says, and what we can do about it.
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