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The HDS introduces a centralized data source/sink mechanism, streamlining testing processes for various high-speed interfaces such as Automotive Ethernet, Automotive SerDes, PCIe, Video, USB, and other differential signals up to 12Gbps.
Offering an improved shield design over previous-generation solutions, and polarity marked for more consistent EMI performance, the Vishay Dale IHLE-4040DDEW-5A lowers costs and saves board space by potentially eliminating the need for separate board-level Faraday shielding.
Samtec has announced availability of its NovaRay cable assemblies that combine extreme density and performance by using 40% less space than traditional arrays to support 112 Gbps PAM4 per channel.
TDK Corporation announces its new radio wave absorber IS-BP series, containing more than 25 wt% of biomass material, making it an environmentally sustainable option that enables CO₂ reduction.
Vishay Intertechnology, Inc. announced that 5 W devices in its AC and AC-AT series of cemented, axial-leaded wirewound resistors are now available with a pick and place friendly SMD lead bending option, the WSZ lead form, that allows the devices to be used as surface-mount components.
In this guide to paper submission best practices, Bert Simonovich reviews DesignCon's CFA evaluation criteria and requirements, offering helpful advice for first-time submissions.
Qualcomm reveals what consumers and enterprises can expect across productivity, creativity, and entertainment from a new category of PC’s, the Copilot+ PCs that today are only powered by SnapdragonX Elite and SnapdragonX Plus Platforms.
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