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Christopher Cheng received the B.S. and M.S. degrees in Electrical Engineering from Cornell University, Ithaca, NY in 1987 and 1989 respectively. From 1989 to 1996.
Mr Cheng worked for the Sun Microsystems Corporation, CA, USA, as a Signal Integrity engineer. From 1996 to 1999, he worked for Intel Corporation, CA, USA, as a Principal Engineer. In July 1999, he joined 3PAR Data Corporation as a Principal Engineer, Fremont, CA. Currently, he is with Storage Division in Hewlett-Packard Enterprise Company as a Distinguished Technologist
Get the details on a space-efficient method that is accurate up to medium/high frequency with high testing throughput while being cost effective (and using almost all existing testing infrastructures) in a high-volume PCB manufacturing environment.
