A particularly challenging configuration is the edge launch, where connectors are used on the edge of the PCB with a transition to a microstrip trace. A poorly optimized connector footprint leads to degradation of the signal integrity performance, especially at high data rates. This paper identifies the root cause of the problem by showing how the electromagnetic fields behave at the transition area. Then it presents a design methodology, using simulated and measured data, that ensures the quality of high-speed data transmission.
