Richard Ericson

Richard B. Ericson received a BSEE from Iowa State University in Ames, IA. He is currently a Project Engineer at the Mayo Clinic Special Purpose Processor Development Group where he focuses on signal and power integrity research and analysis.

ARTICLES

4639Thumb.jpg

Plated-Through-Hole Via Design Specifications for 112G Serial Links

Recent studies indicate that the industry is nearing the precipice where plated through hole via technology has reached a limit in supporting serial links with 28 GHz Nyquist frequency requirements. At DesignCon2021, a team from the Mayo Clinic presented this paper about their work to extend the “life” of conventional PCB technology.


Read More