Idan Ben Ezra

Idan Ben Ezra is a Senior Hardware and PI engineer at Broadcom Semiconductors, DNX group of CSG-Switch Products, in Israel. At Broadcom, Idan is a focal point in full system Power Delivery Network analysis design stages. He develops PI co-simulations and automation flow to cover corner cases (both together & separate) for board (from VRM), socket, package & interposer (die with HBMs) - IR drop, PDN, and time domain transient response simulation. Idan has hands-on experience with lab power measurements, including correlation to simulation. Previously, Idan worked at Valens, where he was instrumental as a board designer and simulation engineer for high-speed automotive chips. In addition, he has co-authored numerous DesignCon papers on PI-related topics and received the prestigious DesignCon Best Paper Award in 2024. Idan holds a Practical & a Bachelor (Honors) in Electronics and Computers Engineering from HIT, Israel.

Design, Simulation, and Validation Challenges of a Scalable 2000 Amp Core Power Rail

DesignCon 2024 Best Paper Award Winner

July 18, 2024

Steve Sandler, Benjamin Dannan, Heidi Barnes, Idan Ben Ezra, and Yu Ni

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This paper comprehensively addresses the numerous challenges presented when designing a power distribution network for a scalable 2000 Amp power supply and provides a complete process for designing, simulating, and validating a 2000 Amp core power rail.

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