Items Tagged with 'PCB'

SLH/TLH PCB board-to-board connectors are part of Samtec’s Ultra Micro line of products that maximize overall space and offer reliable connections in high data rate rugged environments such as automotive, industrial IOT, robotics, and military and aerospace.

Amphenol RF announced the expansion of their non-magnetic offerings with new SMPM PCB designs.

This DesignCon 2024 paper, a Best Paper Award winner, introduces a new process utilizing heuristics to determine laminate anisotropy based on Dk/Df construction tables provided by laminate suppliers.

OMRON Electronic Components is excited to announce its participation in the upcoming RE+ 24, the largest clean energy event in North America. 

This paper comprehensively addresses the numerous challenges presented when designing a power distribution network for a scalable 2000 Amp power supply and provides a complete process for designing, simulating, and validating a 2000 Amp core power rail. 

This article covers the importance of proper calibration, measurement, and de-embedding to ensure that the final capacitor model is free of errors, allowing an accurate representation of the PDN used in simulation. While capacitor models may play a seemingly minor role in the overall system design, the impact of capacitor models can significantly impact the system design and, importantly, design sign-off.

Available freely to Samtec customers under NDA, SIBORG works with Ansys HFSS 3D Layout to generate, visualize, optimize, and develop PCB package and component break out regions.

Since woven glass PCB substrates are anisotropic, EDA design and modeling software hoping to advance AI and ML algorithms should have provisions to model anisotropic material, especially via transitions. In this article, Bert Simonovich discusses the importance of having an awareness of the test method used by CCL suppliers for accurate modeling and simulation. Simonovich covers how the use of out-of-plane Dk_z values instead of in-plane Dk_xy values for via modeling can cause misleading simulation results, which may result in reduced margins and potential compliance test failures when the design is built and tested. 

The expansion of the resin systems in laminates has been a source of reliability problems as the electronics industry has placed ever higher demands on those used in printed circuit boards. Suppliers of these resin systems have improved their resin systems to eliminate or minimize failures from expansion as the systems using the PCBs have been made more complex and subjected to ever harsher environments. Currently, the only technologies that still suffer failures from resin expansion with temperature are triple-high stacked blind vias, which Lee Ritchey explores in this article.

For power conversion in industrial and telecom applications, the Vishay Siliconix SiZF4800LDT increases power density and efficiency while enhancing thermal performance, reducing component counts, and simplifying designs.