Items Tagged with 'Package'

Optimized for industrial and automotive applications, the 1 A and 2 A rectifiers not only offer the best trade-off between reverse recovery charge and forward voltage drop for devices in their class but also provide the lowest junction capacitance and recovery time.

Providing the company's customers with higher-density options for a wide range of applications, the new devices are built on a new process technology to deliver improved performance—with lower power consumption and higher speeds and transfer rates—at a lower cost.

Available freely to Samtec customers under NDA, SIBORG works with Ansys HFSS 3D Layout to generate, visualize, optimize, and develop PCB package and component break out regions.

Infineon Technologies AG introduces the SSO10T TSC package with OptiMOS MOSFET technology.

It may have gone somewhat unnoticed but for the first time ever, Ansys released software into the open source late last year. The software is PyAnsys, a family of Python packages providing a new, unified programmable interface to the company’s proprietary simulation stack. Learn more about this development.

This paper is a case study on causality problems in PDNs during power-aware SI simulations. It covers the causality of a PDN, and it reveals the impact on a design if a causality check is not done on the PDN for the package or board.