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Successfully designing a PCB with more than one impedance while maintaining a manufacturable and economical product
can be a difficult challenge. By examining the histories and uses of various impedances, Lee Ritchey simplifies the process and discusses the ideal impedance for PCB stackup design.
YINCAE, a leading manufacturer of high-performance electronic materials, has announced the release of its breakthrough product Thermal Underfill - UF 158A2.
In this article, Bert Simonovich explores how to avoid “garbage in, garbage out” with field solvers by building an understanding of the nuances of PCB fabrication processes, the interpretation manufacturers’ data sheets, and the tool’s user interface.
Keysight enhanced the x1149 Boundary Scan Analyzer with support for the new IEEE 1149.1-2013 and IEEE 1149.6-2015 standards, allowing advanced boundary scan testing beyond typical structural tests and significantly increasing test coverage on PCBs.
Featuring low 0.88 mm profile and wettable flanks, Automotive Grade 200 V, 400 V, and 600 V devices provide improved thermal performance and efficiency.
Teledyne e2v and Texas Instruments (TI) have collaborated on a new radiation-tolerant DDR4 modular platform to help satellite OEMs streamline their system development work.
In this overview of the principles of high-performance PCB layout, Joe Aguilar illustrates thermal design approaches, supplies a synopsis of the power delivery network (PDN), tells strategies for routing high currents with reduced impedance, and provides important considerations for designing effective decoupling capacitance.
Join Eric Bogatin, SIJ Technical Editor in his conversation with Amit Bahl, the PCB Guy discussing free PCB design tools, why the relationship you have with your fab shop is a critical ingredient.
