Articles Tagged with ''PCB''

Far-field Emissions from PCB Cavities_thumb

Far-field Emissions from PCB Cavities

In high-speed circuit designs, power integrity (PI) and electromagnetic interference (EMI) are connected together. When the edge of the cavity created by power (PWR) and ground (GND) planes in PCBs radiates, the peak frequencies in the emissions are the same as the peak frequencies in the cavity self-impedance.


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Power Electronics vs. Power Integrity

The power electronics engineer and the power integrity engineer share a common goal: provide the system with the correct voltages, currents, and noise characteristics to achieve the desired performance. Unfortunately, they do not share much else. They generally use different tools, vocabulary, and figures of merit. As a result, both sides lose.


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40 GHz PCB Interconnect Validation: Expectations vs Reality

What does it take to design PCB interconnects with good analysis-to-measurement correlation up to 40 GHz? Is it doable with typical low-cost PCB materials and fabrication process, typical trace width, via back-drilling and the shortage of space to place the stitching vias? This paper reports lessons learned from validation projects with the goal to build a formal procedure for systematic prediction of interconnect behavior up to 40 GHz. Topics include: selection of test structures, connectors and measurement equipment, and analysis uncertainties.

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