Articles Tagged with ''PCB''

Semiconductor signal conditioning and signal recovery innovations have extended data rates by managing allowable signal-to-noise ratio (SNR) at progressively higher Nyquist frequencies. We have experienced how each successive signaling technology increases the electro-mechanical design resolution needed to address the channel physics while respecting the SNR of the chips. These movements throughout the years have provided a baseline of traditional design goals that lead us to better understand today’s 224 Gbps-PAM4 physical layer requirements.

SierraConnect is a unique forum where you can get professional-grade answers to all your PCB questions.

Ventec Giga Solutions has announced it has been appointed as sales agent and distributor of specialist PCB lamination materials from Cardel.

In this installation of Engineering Nightmares, Robert Haller explores a keystone rule to keep in mind when troubleshooting signal integrity problems. Learn why signal integrity engineers should never perform a measurement or simulation without first anticipating what they expect to see.

Rogers Corporation will exhibit at PCB West in Santa Clara, Calif., (booth #201) highlighting some of its high performance circuit materials used in multilayer structures which include a family of thin laminates and bonding materials.

This paper investigates via and trace coupling effects using measurements, hybrid, and full-wave solvers by de-embedding/calibration utilizing multiple test-boards.

The roughness of copper foils has a detrimental effect on signal loss in PCBs. Therefore, reducing roughness is crucial in minimizing signal loss. Nevertheless, roughness is essential to ensure a good adherence between the prepreg and the copper foil. A compromise must be found between adherence and power integrity. This paper presents a novel approach to evaluate signal loss without assuming any specific roughness shape.    

Design of PCB-based PDNs has become a challenge due to rising power consumption, lowering supply voltages, increasing integration density and design complexity. In this paper, we propose an algorithmic procedure using supervised machine learning techniques to provide expert guidance on the PDN design and optimize power supply decoupling capacitors. The proposed method replaces the computationally expensive numerical simulations with faster ANNs.

By using Soluboard for its demo and evaluation boards, Infineon is making another important contribution to the testing of sustainable designs in the electronics industry.

In preparation for 224 Gb/s and beyond, Samtec engaged in a research project to characterize the transmission performance of emerging PCB material sets. Brandon Gore explores the current state of the art for PCBs and cables, comparing them and assessing the technology gap to fully support the insertion loss performance required for higher data rates.