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As Dave Dunham from Molex Corp. likes to say, "When designing high-speed serial links beyond 10 GB/s, everything matters." In order to ensure first time success at these speeds, accurate channel modeling is a prerequisite. This is especially true for long backplane channels.

The EDI CON USA 2017 keynote speakers addressed the latest engineering trends and challenges in our industry from “in the trenches” stories of design challenges, successes and failures from “Bet Your Job” to “5G in 5 Years” look into the future to a behind the scenes look at T&M. Below are full videos of these featured talks delivered on Sept 12 in Boston.

Each of the five experts presented a different approach to incorporating material properties in simulations to accurately predict a channel’s performance. Read on to see what they had to say.

This paper, presented at EDI CON USA 2017, demonstrates the use of a special probe tip utilized to convert a differential measurement of inductor voltage to a measurement of inductor current. It shows the connection and calibration considerations in the measurement of inductor current, including the digital signal processing algorithms required to compensate for the components in the power supply and the probe tip. It also explains current sharing measurements made in the time and frequency domain using a transient current generator.

Offering a unique combination of training, technical sessions, workshops, panels and a commercial exhibition, EDI CON USA returned to Boston for its second year in the U.S.

Microwave engineers know that sharp corners and right-angle bends have their drawback at high frequencies. So what happens if we go to the other extreme of the spectrum, to DC? Istvan Novak takes a closer look.

Teledyne LeCroy, Inc. and Anritsu Company U.S. announce today a partnership to provide the industry’s most capable PCI Express 4.0 (PCIe Gen4) test solution, integrating the Anritsu Signal Quality Analyzer (SQA) MP1900A BERT with the LabMaster 10Zi-A oscilloscope and QPHY-PCIe4-Tx-Rx software from Teledyne LeCroy. This comprehensive system provides high-speed IC, device, and network engineers with one complete solution to conduct automated transmitter and receiver compliance tests, as well as link equalization verification.

It's a fact, the older I get, the dumber I become. I came to that realization while thinking about this eternal question engineers have about placement of high speed DC blocking caps in serial link channels. A few years ago I would have been able to recite the pros and cons without hesitation, but now, after playing manager for a few years, before I answer I have to pause and think about it. Fortunately the answer comes back quickly and I can still sleep at night. I find this topic interesting for a few reasons; one, it's a very practical issue found in almost every high speed design, and second, and perhaps more importantly, it's one of those topics were intuition might lead you the wrong way.