Signal Integrity

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Design of PCB-based PDNs has become a challenge due to rising power consumption, lowering supply voltages, increasing integration density and design complexity. In this paper, we propose an algorithmic procedure using supervised machine learning techniques to provide expert guidance on the PDN design and optimize power supply decoupling capacitors. The proposed method replaces the computationally expensive numerical simulations with faster ANNs.

This paper proposes a model that can serve as a tool for evaluating FEC choices in 200+ Gb/s applications. It allows the comparison of the effect of different inner/outer codes and inner-FEC interleaving schemes on post-FEC BER. It can also be used as a tool for system-level transceiver design, allowing designers to see the impact of design choices on the post-FEC BER efficiently.

The Xpeedic EDA 2023 Suite includes 2.5D and 3D signal integrity and power integrity simulation for advanced packaging, along with three platforms to support 3D EM simulation, multi-domain co-simulation, and high-speed system simulation.

Primarius Technologies will showcase its DTCO-enabled EDA solutions powered by the latest generation SPICE and FastSPICE technologies at the Design Automation Conference.

Copper foil and oxide roughness are also major drivers of insertion loss behavior. As discussed in Part 1 of this article series, the first crucial step to efficacious design and development is understanding how the dielectric material attributes are to be carefully considered when assessing impedance and insertion loss performance. This article by Keshav Amla highlights the importance of considering roughness attributes in this assessment, ensuring a well-rounded approach to addressing impedance and loss, as well as skew, a signal integrity concern of ever-increasing importance.

This article series by Keshav Amla of Avishtech provides an introduction and overview of the dielectric materials upon which a PCB is built, focusing on what comprises these materials; the data available from the materials vendors; how the key material attributes drive performance; and how these ideas can be leveraged in the development of new product implementations.

Rohde & Schwarz and Zurich Instruments will present advanced test and measurement solutions for photonics at the LASER World of PHOTONICS tradeshow in Munich. 

Keysight meets the need of design engineers with the first PCIe 6.0 Protocol Analyzer and PCIe 6.0 Protocol Exerciser. These cable-free solutions provide testing versatility and enable faster, more confident testing of PCIe 6.0 technology designs.

With summer upon us, it’s time to catch up on the webinars we might have missed in the last year. Here is a viewing list of the high value video content I will be reviewing in this column over the summer.