Power Integrity

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VRMs and VRM controllers are often selected based on size, efficiency, price, or a relationship with the manufacturer. This often leads to a poor VRM selection, requiring additional engineering resources, greater time to market, as well as, higher BOM costs to correct the deficiencies. In this article, we evaluate the choices, define some useful figures of merit, and provide specific selection suggestions.

A common design technique for power distribution networks (PDN) is the determination of the peak distribution bus impedance that will assure that the voltage excursions on the power rail will be maintained within allowable limits, generally referred to as the target impedance. In theory, the allowable target impedance is determined by dividing the tolerable voltage excursion by the maximum change in load current.

Teledyne e2v is launching a complete GaN power solution based on technology from pSemi (formerly Peregrine Semiconductor) and GaN Systems. The solution features GaN FETs and the industry’s first rad-tolerant, half-bridge power driver for GaN high-reliability applications. The technology will be demonstrated at Satellite 2018 March 12-15 in the Teledyne Defense Electronics booth (#619).

Power distribution networks (PDNs) delivering power to ICs in a system need to be thoroughly designed and analyzed in order to make sure any voltage fluctuation on the rail is within the tolerance of every IC connected to that rail.  As ICs on the rail draw power, they generate a voltage fluctuation on the rail.  The PDN must have the capacity to supply enough charge such that the resulting voltage drop is less than the maximum voltage drop each IC on the rail can tolerate.  If voltage fluctuations appear outside IC tolerance limits, a slew of problems can surface such as IC damage, failure, or reduced lifespan.

Mitsubishi Electric US, Inc., Semiconductor and Device Division will exhibit for the first time at Applied Power Electronics Conference (APEC) in San Antonio, March 5-7, 2018.  The Semiconductor and Device Group will display its full lineup of power semiconductor products (formerly the Mitsubishi Products and Accessories Division of Powerex, Inc.) in booth #919.

No matter how well you understand the design principles, and no matter how much experience you have in designing boards, it’s easy for some problems to slip through the cracks because you just forgot to check that feature, or your design is just too big to manually check. This is where a design rule checker comes in.

DesignCon has been a tremendous source of information for myself and for the team I have been working with at SUN Microsystems, which later became part of Oracle Corporation. This summary is an attempt to capture some of the most influential papers from the past twenty years that made the biggest impact on our work.

This article presents a method for power integrity analysis in FPGA systems by configuring the FPGA to function as a vector network analyzer (VNA) test instrument for its own power distribution network (PDN).

It’s what you don’t know you don’t know that can ruin your day. This paper notes in detailed examples that with today’s high-speed designs, we can no longer restrict our thinking in terms of signal integrity, power integrity or EMC alone. We must consider all three disciplines and become educated about each of them to achieve successful designs.

Picotest.com, has released a new solid-state Semi-Floating Amplifier (SFA), or ground loop isolator, that provides the BEST isolation for low impedance measurements. The new amplifier eliminates the DC ground loop from DC up to 800MHz.