Power Integrity

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Why Are There So Many Standards?

There seems to be more standards every day, and some have rumored that there is a movement to merge or consolidate some existing standards. We will examine some of the standards and how they came to be. For starters, we will limit ourselves to three main types of standards in the industry: on-board or internal, input/output (I/O), and networking. I/O and networking are similar, but networking standards typically apply to longer distance links than I/O standards. There is, as often happens, overlap between these types, and some, such as PCI-express, have standards that apply to more than one of them.


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Why Full VRM Characterization is Essential

The voltage regulator module (VRM) contributes system level noise in several ways. Power integrity (PI) engineers tend to focus on transient voltage noise related to high-speed dynamic current. Many PI simulators ignore the VRM noise and use an ideal resistor and inductor model to represent the VRM. This overly simplistic approach misses many potential system level issues.


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Making a Steamy, Hairy Golf Ball

My friend Steve Sandler pointed out a major hurdle we face in power distribution design: power engineers (who design power converters) and power integrity engineers (who design system bypassing-decoupling networks) use different vocabulary, techniques, and requirements. To understand a little better how we got here, I want to start with a prediction I heard sometime in the early 90s at one of the conference keynote speeches: “In 10 to 20 years, computers will look like hairy steamy golf balls.” 


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Test Your TDR with a DMM

A TDR (time domain reflectometer) is an instrument that probably has the fastest rise time of any instrument in your lab, but how accurate is it? Eric tests accuracy using a DC Ohmmeter in this piece.


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