Power Integrity

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Microchip’s IGBT 7 portfolio is available with multiple topologies, current, and voltage ranges.

Richardson Electronics, Ltd. and Navitas Semiconductor have announced an expanded distribution partnership for next-gen silicon carbide power semiconductors for Europe, the Middle East, and Africa.

The new TICP Series IsoVu isolated current probes are the world’s first to utilize RF isolation, delivering exceptional precision and safety when measuring fast-changing current across both low- and high-voltage systems.

The ultra-wide input voltage range gives the new MicroModule a robust resistance to voltage transients on the 48 V bus. 

Infineon launches a new family of high-voltage discretes, the CoolGaN Transistors 650 V G5, further strengthening its GaN portfolio.

Infineon has reached a breakthrough in handling and processing the thinnest silicon power wafers ever manufactured, with a thickness of only 20 μm and a diameter of 300 mm, in a high-scale semiconductor fab.

Vicor Corporation has released three automotive-grade power modules for 48V EV systems that deliver industry-leading power density and will support automotive OEM and tier one production in 2025. 

Infineon launches the TDM2354xD and TDM2354xT dual-phase power modules with best-in-class power density for high-performance AI data centers.

By combining their advanced simulation, software model development, and validation techniques, Modelithics and SES will collaborate to address critical challenges faced by high-speed electronic and power electronic systems designers.

The power electronics supply chain has undergone a phase of rapid expansion in manufacturing capacity, particularly for SiC and silicon devices, as well as SiC wafers.