Michael Klempa

Michael is a Product Marking Specialist at Alphawave Semi for high-speed applications such as 112G and 224G CEI and Ethernet, and Gen6 and Gen7 PCIe. He is currently serving as the Optical Interconnect Forum's (OIF) Interoperability Physical Link Layer Chair. He contributes to the 802.3 Working Group, including editing the 802.3bz specification. Previously, he was an Electrical Engineer at Amphenol ICC designing 400G Optics and Technical Manager at the University of New Hampshire Interoperability Laboratory (UNH-IOL). He obtained his Bachelor of Science in Electrical Engineering in 2013 and his Masters in Electrical Engineering in 2017. He has participated on panels at DesignCon and has works published in EDN Network. 

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