Items Tagged with 'IEEE'

In this field guide, David Banas of Keysight explores COM from specification to practice. From mapping out the pitfalls to avoid to explaining the discrepancies between the specification and the MATLAB code, Banas guides the link designers through a successful first experience with COM.

In recent years, the IEEE Electrical Packaging Society technical committee for electrical design, modeling, and simulation recognized the need for open-source benchmarks for the simulation tool, verification, and test and measurement solution vendors. The intention is to overcome the obstacles that developers and users of such tools and instruments often encounter and create a growing library of benchmark cases for signal and power integrity challenges. As of October 2023, there are four published benchmark cases in the repository. This article describes a proposal for a fifth benchmark.

Vector now supports the IEEE standards for Automotive Ethernet 2.5GBASE-T1, 5GBASE-T1 and 10GBASE-T1 in its VN5650 and VN5240 Automotive Ethernet interfaces. 

In this article, Cathy Liu discusses how channel error models and FEC performance analysis have been updated according to industry changes, as well as how different Ethernet coding schemes have been studied and simulated for 800GE and 1.6GE systems with 200 Gbps per lane. Liu investigates concatenated FEC with soft-decision decoding for inner code to protect 200 Gbps optical link and the effect of different FEC options on system SI.

Under the theme “Devices for a Smart World Built Upon 60 Years of CMOS,” the 69th annual IEEE IEDM has issued a Call for Papers seeking the world’s best original work in all areas of microelectronics research and development.

Keysight enhanced the x1149 Boundary Scan Analyzer with support for the new IEEE 1149.1-2013 and IEEE 1149.6-2015 standards, allowing advanced boundary scan testing beyond typical structural tests and significantly increasing test coverage on PCBs.

The fixtures used to characterize interconnects in complex systems can have a significant effect on the measured data, read on to get the background and perspective on IEEE P370. Check out this Outstanding Paper Award Winner from EDI CON USA 2018.