Power Integrity

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Eric Bogatin shares a selection of free resources with high-value content to related to SI/PI/EMI. Check out these resources to learn new engineering principles, migrate to new fields, and keep up with the latest technology solutions and best design practices.

In this article, Steve Sandler presents several methods of measuring battery impedance, discussing the reasons for conducting such measurements and the challenges one might encounter along the way.

Microchip’s IGBT 7 portfolio is available with multiple topologies, current, and voltage ranges.

Richardson Electronics, Ltd. and Navitas Semiconductor have announced an expanded distribution partnership for next-gen silicon carbide power semiconductors for Europe, the Middle East, and Africa.

The new TICP Series IsoVu isolated current probes are the world’s first to utilize RF isolation, delivering exceptional precision and safety when measuring fast-changing current across both low- and high-voltage systems.

The ultra-wide input voltage range gives the new MicroModule a robust resistance to voltage transients on the 48 V bus. 

Infineon launches a new family of high-voltage discretes, the CoolGaN Transistors 650 V G5, further strengthening its GaN portfolio.

Infineon has reached a breakthrough in handling and processing the thinnest silicon power wafers ever manufactured, with a thickness of only 20 μm and a diameter of 300 mm, in a high-scale semiconductor fab.

Vicor Corporation has released three automotive-grade power modules for 48V EV systems that deliver industry-leading power density and will support automotive OEM and tier one production in 2025. 

Infineon launches the TDM2354xD and TDM2354xT dual-phase power modules with best-in-class power density for high-performance AI data centers.