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The paper discusses the development of GDDR6 as a lower-risk and more cost-effective solution as compared to other high-bandwidth memory solutions.

If you are working on chip and package design, ground bounce is an important concern.  SIJ Technical Editor Eric Bogatin and his University of Colorado students share the results of a study in best design practices to minimize ground bounce noise.

This paper evaluates the performance of several choices of Reed-Solomon code and shows how a frame-interleaved RS(30,26) code can achieve 1e-15 bit-error rate (BER) in the presence of burst errors. See the authors conclude that, as data rates go higher, current 128b/130b encoding is not a good option as the two-bit 01/10 overhead suffers due to its Nyquist pattern property.

This paper reviews four levels of VRM models that VRM designers, board level interconnect designers, semiconductor designers, and product managers often use to explore design tradeoffs throughout the PDN system. The choice of which one to use involves considering engineers’ levels of expertise and what problems they expect to analyze. Some tradeoffs and relative merits of the models are described.

PCIe Gen4 enables new wave of innovation to guide inner-loop SerDes optimization assisted by outer-loop system optimization. This paper introduces an outer-layer equalization scheme for managing SerDes inner-layer equalization to optimize overall system-level aggregate performance.

In the GB/s regime, accurate modeling of insertion loss and phase delay is a precursor to successful high-speed serial link designs. We propose a causal (physically meaningful) form of the Hammerstad and Cannonball-Huray metal roughness frequency dependent complex correction factor. Compared to the widely used, non-causal form, it considerably increases the inductive component of internal metal impedance. Transmission lines simulated with a causal version demonstrate increased phase delay and characteristic impedance. By obtaining the dielectric and roughness parameters solely from manufacturers' data sheets, we validate the model through a detailed case study to test its accuracy.

New power-semiconductor technologies like SiC and GaN enable increased efficiency and higher switching frequencies, which allows smaller component sizes. But these gains come at the expense of greater radiated electromagnetic emissions, just as EMC regulations are getting tougher. How can engineers effectively minimize radiated EMI?

Receiver sensitivity and noise coupling to antenna are two major concerns when developing mobile devices such as smart phones and tablets. There are various causes of degradation of receiver sensitivity. However, most of the time they are due to the noise generated by digital signal harmonics on printed circuit board (PCB) patterns, which couple to the antennas. This article presents a methodology to predict noise to antenna coupling and antenna desense.