Richard Mellitz

Richard Mellitz is presently a Distinguished Engineer at Samtec, supporting interconnect signal integrity and industry standards. Richard has been a key contributor to IEEE802.3 electrical standards for many years. He led efforts to develop radically new IEEE and OIF time domain specification methods called COM (Channel Operating Margin) and ERL (Effective Return Loss). Early in his career he founded and chaired an IPC committee authoring the industry’s first TDR standard. Richard holds many patents in interconnect, signal integrity, design, and test. Richard received the IEEE Standards Association Medallion and the Intel Achievement Award (IAA) for spearheading the industry’s first graduate signal integrity programs at the University of South Carolina. Recently, Richard was honored with the DesignCon 2022 Engineer of the Year Award.

Distinguished Engineer, Samtec

Samtec DesignCon Paper Summary Cover.jpg

Are 1.0 mm Precision RF Connectors Required for 224 Gbps PAM4 Verification?

DesignCon 2024 Best Paper Award Winner

October 15, 2024

Brandon Gore, Richard Mellitz, Andrew Josephson, Luis Boluña, John Calvin, Rick Rabinovich, and Mike Resso

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This paper, awarded the Best Paper Award at DesignCon 2024, explores what is meant by bandwidth during the standardization process, the implications of test and verification attached to certain bandwidth requirements, as well as differences between acquisition range, band limited filters, and s-parameters for time domain processing.

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